Semiconductor application materials
左右尚有資訊
System | Wafer(Inch) | Target Size(DxT) | Bonding Type | |||
Solder | Monolitic | |||||
EB | DB | |||||
AMAT | Endura 5500 | 6 | 286x50 | O | ||
Endura 5500 | 8 | 323x48 | O | |||
Alps | 8 | 340x17 | O | |||
Endura SL | 12 | 437x25 | O | |||
ANELVA | ILC-1051 | 6 | 314x27 | O | ||
ILC-1060 | 8 | 353x30 | O | |||
ILC-1080 | 8 | 296x30 | O | |||
ILC-1201 | 12 | 396x30 | O | |||
ULVAC | Ceraus Z-1000 | 6 | 262x27 | O | ||
Ceraus Z-1000 | 8 | 306x27 | O | |||
Ceraus Zi-1000LTS | 8 | 300x23 | O | |||
Entron | 12 | 390x86 | O | |||
MRC | SPA-10 | 4 | 254x36 | O | ||
SPA-12 | 6 | 295x41 | O | |||
RMA-10 | 4 | 254x47 | O | |||
RMA-12 | 6 | 295x48 | O |
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