Arisawa polyimide protect film could be easily released without adhesive after thermal + pressure pressing, and suitable for temporary fixing of small parts for embedding to PCB, or surface protection, preventing a penetration of chemical solution due to excellent following towards gap  of adherend.
 

    

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Kevin.Chung +886 3 571-1499 # 722
Kevin.Chung@mail.sumitronics.com.tw